| 摘要 |
PURPOSE: To provide a semiconductor laser device and a manufacturing method which can prevent reduction in the yield caused by cracks of breakage of chips generated when the chips are isolated even if the intervals among the light emitting points are made narrower, and also prevent deterioration in heat dissipa tion and restrain the discrepancies in the relative angles of a plurality of laser beams. CONSTITUTION: A plurality of semiconductor laser bars are stacked by a predetermined stacking method and the edges of the cleaved planes of the semiconductor laser bars are aligned on a predetermined flat plane so as to be bonded each other. As for the predetermined stacking method, a method of stacking them in y-axis direction with the stripe side downward, and a method of stacking them in y-axis direction with the stripe side being the bonding plane, are available. Furthermore, a structure in which a sub-mount member is interlaid between the semiconductor laser bars for improving the heat dissipation is available. The semiconductor laser bars can be also mounted being slid each other in a z-axis direction.
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