APPARATUS FOR CLEANING REAR SURFACE OF SEMICONDUCTOR WAFER AND METHOD FOR CLEANING REAR SURFACE OF SEMICONDUCTOR WAFER USING THE SAME

摘要

PURPOSE: An apparatus for cleaning a real surface of semiconductors wafer and a method for cleaning a real surface of a semiconductor wafer using the same are provided to minimize cleaning time and to effectively remove particles of the rear surface of a wafer by cleaning the rear surface without the deposition of a photoresist on the wafer through a structural improvement. CONSTITUTION: A rear surface cleaning apparatus(100) comprises a fluid scattering prevention cover(110), a wafer circulation unit(130), a fluid supply unit(150) and a center control unit for entirely controlling the rear surface cleaning apparatus(100). The fluid scattering prevention cover(110) having a bowl shape further includes a hole(118) having a defined diameter for connecting with the wafer circulation unit(130), bearings(112) formed on the inner surface of the hole(118) for circulating the wafer circulation unit(130) and bushings(114) formed in the inner portions of the bearings(112) for supporting the wafer circulation unit(130).