WAFER DRYING METHOD

摘要

PURPOSE: A wafer drying method is provided to easily remove a deionized water or a moisture on a surface of a wafer due to a fluid treatment and a wet processing by using a polar organic solvent vapor. CONSTITUTION: A wafer(40) is firstly rinsed in a rinse zone(22) by a deionized water(50) supplied from a flow deionized water supply(30). By raising the wafer(40) to a deionized water surface, the deionized water is exhausted through an overflow unit(23) and the second rinse is performed on the wafer(40) by one way stream through a one way stream module(25). A substitution/drying zone substitutes a polar organic solvent vapor for the deionized water(50) and a moisture on the surface of the wafer(40). The wafer(40) is dried by removing the adsorbed polar organic solvent vapor on the wafer(40) using only an inert carrier gas supplied from a spray zone(10).