| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a package for a semiconductor, wherein roughening treatment of a conducting layer is made unnecessary, and loss on a roughened surface of the conducting layer, signal waveform distortion and transmission delay which are caused by the skin effect are not present, and a package in which heat dissipating property is very superior while merit of an organic package is used. SOLUTION: This package for a semiconductor has a wiring pattern 7 constituted of an insulating layer 3 having a thickness of at most 70μm which a plurality of metal posts 4 composed of Cu or Cu based alloy or Fe-Ni based alloy penetrate, an easily bonded layer 2 having the thickness of at most 1μm which is laminated on the layer 3 and composed of Ti, Sn, Ni and Al or alloy of them, and a conducting layer 1 having a thickness of at most 18μm which is laminated on the layer 2 and composed of Cu or Cu based alloy of Fe-Ni based alloy. The package can be used for semiconductor which processes a high frequency signal of 100 MHz or higher.</p> |
