| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be manufactured at a low cost even if the chip design rule and the chip size are changed, and also to provide a method of manufacturing the same. SOLUTION: On a wiring board 1 formed, on the top surface, with a multilayer interconnection, a lower chip 2 is bonded using an insulating adhesive or the like. Electrodes 2a formed in the peripheral part of the top surface of the lower chip 2 and electrodes 1a formed on the top surface of the wiring board 1 are connected by metal wires 3 to electrically connect the lower chip 2 and the wiring board 1. On the side of the lower chip 2 on the wiring board 1, a spacer 5 higher than the thickness of the lower chip 2 is bonded using an insulating adhesive 5a. Furthermore, an upper chip 6 is bonded on the top surface of the spacer 5 using an insulating adhesive 5b. Electrodes 6a formed in the peripheral part of the top surface of the chip 6 and the electrodes 1a formed on the wiring board are connected by metal wires 7 to electrically connect the upper chip 6 and the wiring board 1. |
