ADHESIVE FILM, SUBSTRATE FOR LOADING SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive film of excellent in handling by solving the problems of burrs and chips, etc., at the time of punching. SOLUTION: This adhesive film is composed by providing an epoxy-based thermosetting adhesive material layer on both surfaces of a polyimide film for which the average value R (kgf/20 mm) of the tear resistance at the end of the film and the thickness T (μm) of the film are in the relation indicated by the following expressions; R>=0.9×T (in the case of T<=75) and R>68 (in the case of T>75).