发明名称 LAMINATED BELT FOR TAB, ITS MANUFACTURING METHOD, PRINTED WIRING BOARD MADE THEREOF, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a laminated belt for a TAB within an industrially, fully practical technique range, which has sufficient Cu thickness and has improved convenience, and to provide a method for manufacturing the laminated belt continuously, a printed wiring board having improved electric characteristics, and a semiconductor device. SOLUTION: After a metal layer made by a dry film method is deposited and formed at least at one surface side of a surface to be deposited of a resin tape and a dry film resist tape in a vacuum bath, the resin tap and the dry film resist tape are applied and jointed in the manufacturing method of the laminated tape for a TAB.
申请公布号 JP2002222836(A) 申请公布日期 2002.08.09
申请号 JP20010019918 申请日期 2001.01.29
申请人 HITACHI METALS LTD 发明人 YANO KENTARO
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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