| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a specific region in a polyimide layer cannot be removed accurately and easily by a laser beam, and that a copper layer that is formed by deposition is damaged although a method for applying a laser beam is known as a means for removing the polyimide layer of a copper- clad polyimide film. SOLUTION: First, a laser beam is applied to a specific region in the polyimide layer for several times, the polyimide layer is left to the extent that copper is not damaged, and then remaining polyimide is removed by plasma etching that is capable of accurate machining treatment, thus obtaining a desired copper pattern.
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