| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which gives a cured product having excellent moisture resistance and good welding crack resistance, especially a suitable cured product, in a material for sealing semiconductor. SOLUTION: The thermosetting resin composition has, as essential components, a curing agent (A), which comprises a phenolic resin having a structure obtained by adding to an aromatic hydrocarbon containing a phenolic hydroxyl group in a molecule (a) a compound having two ethylenically unsaturated double bonds (b1) and a compound having an ethylenically unsaturated double bond (b2), and an epoxy resin (B).
|
