| 摘要 |
PROBLEM TO BE SOLVED: To provide a jig for a semiconductor, which can raise the quality of a heat-treated wafer. SOLUTION: A jig 1 for a semiconductor is one which is used for a heat treatment of a wafer in a semiconductor process, the jig 1 is constituted of a silicon carbide film formed by a CVD method, a wafer pocket 10, which is used as a recessed place for mounting the wafer, is provided in the top face 12 of the jig 1 and at least a light-shielding layer 13 is provided in the interior of the jig 1 so as to cover the wafer pocket 10.
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