| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wav device that can be downsized without causing deterioration in electric characteristics. SOLUTION: A bump is connected to a lead electrode provided to a base board. On the other hand, an interdigital electrode and an electrode pad are formed on a rear side of the piezoelectric substrate to form a surface acoustic wave element. Then an oil solution is formed on the surface of the surface acoustic wave element. The electrode pad and the bump are connected to seal the surface acoustic wave element with a high polymer group material. Finally when the high polymer group material is heated, the high polymer group material is cured and contracted, removed from the upper or lower face of the oil solution for die removal and a hollow part is formed between the high polymer group material and the interdigital electrode.
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