| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method therefor wherein there is no restriction on the contour and size of semiconductor chips and semiconductor chips in any contour and size can be stacked so that high-density packaging can be implemented with any combination of the contours of semiconductor chips vertically stacked. SOLUTION: The semiconductor device 41 is provided with a first semiconductor chip 45 bonded to a wiring board 43 by flip chip bonding; a resin barrier 47 formed on the wiring board 43, so that the first semiconductor chip 45 is encircled with the barrier; sealing resin 49 filled inside the resin barrier 47 and cured; and a second semiconductor chip 51 whose underside is bonded to the upper face of the sealing resin 49, and which is provided on the surface thereof with electrodes connected with the wiring on the wiring board 43 through bonding wires 50. |
