发明名称 POSITIVE TYPE PHOTORESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a chemically-sensitized positive type photoresist composition with both its developing faulty performance and line edge roughness simultaneously-improved. SOLUTION: The positive type photoresist composition is provided with (A) a compound generating acid by irradiation of an active light ray or a radial ray and (B) a resin insoluble or hardly soluble for alkali, dissolved by action of acid to increase its solubility in an alkali developer. It is characterized in that the resin of (B) comprises a mixture of at least two types of resins (B1) and (B2) to satisfy the following formula: 9.9>=(B1M)/(B2M)>=1.3 where: (B1M) = dispersity of (B1): Mw (B2M) = dispersity of (B2): Mn.
申请公布号 JP2002221795(A) 申请公布日期 2002.08.09
申请号 JP20010017237 申请日期 2001.01.25
申请人 FUJI PHOTO FILM CO LTD 发明人 FUJIMORI TORU;TAN SHIRO
分类号 G03F7/039;C08L25/18;C08L101/12;G03F7/00;G03F7/033;H01L21/027 主分类号 G03F7/039
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