| 摘要 |
PURPOSE: To provide a compact and thin image pickup device that is easily assembled, and has excellent mass productivity and superior functions, and to provide a method for manufacturing the image pickup device. CONSTITUTION: The light reception surface of a solid-state image pickup element 31 opposes a transparent substrate 11 for jointing, the solid-state image pickup element 31 is sealed with a thermosetting resin 32, and a peripheral IC chip 41 is jointed and laminated on the back side of the light reception surface of the solid-state image pickup element 31 with thermosetting resin 32. Also, the solid-state image pickup element 31 and peripheral IC chip 41 are inserted into a through hole 52 having a counter sink section 53 provided on a printed wiring board 51, the transparent substrate 11 is connected to the printed wiring board 51 with an Au wire bump 24, and a lead electrode at the counter sink section 53 on the printed wiring board 51 is connected to the peripheral IC chip 41 with a wire 61. Additionally, the wire 61, solid-state image pickup element 31, and peripheral IC chip 41 are sealed with a coat resin 71. A lens holder 81 is mounted onto the back of a surface where the solid-state image pickup element 31 on the transparent substrate 11 is jointed with the side of the transparent substrate 11 as reference.
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