发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To realize a further lower temperature process (600 deg.C or lower) by reducing the number of times of heat treating at a high temperature and to realize a simplification of steps and an improvement in a throughput. SOLUTION: A method for manufacturing a semiconductor device comprises the steps of forming an impurity region 18 in which a rare gas element (also called rare gas) is added by using a mask 17 for a semiconductor film having a crystal structure, gettering to segregate a metal element contained in the semiconductor film to the impurity region 18 by heat treating, and then forming a source region or a drain region of the impurity region 18.
申请公布号 JP2002222958(A) 申请公布日期 2002.08.09
申请号 JP20010019337 申请日期 2001.01.29
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 YAMAZAKI SHUNPEI;NAKAMURA OSAMU
分类号 H01L21/20;H01L21/322;H01L21/336;H01L29/786;(IPC1-7):H01L29/786 主分类号 H01L21/20
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