| 摘要 |
<p>A bonding tool (300) for bonding a wire to a substrate. The bonding tool (300) has a body portion (302), a working tip coupled to one end of the body portion (302), an orifice extending along a longitudinal axis of the body (302) and the working tip, and a polymer coating (320) disposed over at least a portion of a surface of the orifice.</p> |
