Resin sealed electronic device

摘要

Durability and lifetime of a resin sealed electronic device is improved by reducing thermal stresses acting on the power element and the parts mounting on the board. A power element of which the protective film on the power element is coated with a polyimide group resin at manufacturing the element is used, and a metallic heat sink of which the reverse side surface (portion of mounting on a board) is not plated is used. Further, a linear expansion coefficient of the molding resin is within a range of 3x10-6/° C. to 17x10-6/° C. The durability and the lifetime of the resin sealed electronic device is improved, because the thermal stresses are reduced by balancing linear expansion coefficients of the parts.