IT LAMINATING DOUBLE-SIDE CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR AND MULTI-LAYER PRINTED CIRCUIT BOARD USING

摘要

A multi-layer printed circuit board comprising, placed one upon another, a plurality of laminating double-side circuit board and a plurality of interlayer connecting prepregs, wherein a via hole extending from a conductor circuit side on one surface of the laminating double-side circuit board up to the conductor circuit on the other surface is provided and is filled with a conductive substance to mutually connect conductor circuits on the opposite surfaces of the laminating double-side circuit board, a pad portion of a laminating double-side circuit board and a pad portion of another laminating double-side circuit board are stacked via an interlayer connecting prepreg so as to allow a conductive substance-filled through hole in the interlayer connecting prepreg to face the pad portions, thereby electrically connecting the pad portions on the surfaces of the laminating double-side circuit boards. Accordingly, multi-layer printed circuit board excellent in connecproduction time.