| 摘要 |
A microwave circuit utilizes a spiral-like coupler configuration (602) to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers (602) are bonded to form the package. A plurality of groundplanes (501, 502, 504) may be used to isolate the spiral-like shape from the lines extending out to contac t pads (901, 902, 903, 904) or other circuitry. |
