| 摘要 |
A wiring board with high reliability capable of effectively preventing the occurrence of migration includes a substrate 1, a glass layer 2 deposited on the top face of the substrate 1, a plurality of conductive layers 3 deposited on the surface of the glass layer 2, and a plurality of plating layers 4 correspondingly deposited for covering the surface of each of the conductive layers 3. The glass layer 2 is partially protruded so as to surround and to overlap both sides of each conductive layer 3, and top ends of the protruded portions 2a are interposed between the conductive layer 3 and the plating layer 4. Even when a large difference in potentials is created between the adjacent conductive layers 3, 3 while the wiring board is used, the protruded portions 2a of the glass layer 2 sufficiently prevents the growth of the metal toward the adjacent conductive layer 3, and effectively prevents the occurrence of migration.
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