发明名称 High voltage transistor using P+ buried layer
摘要 A new design for a high voltage bipolar transistor is disclosed. Instead of a buried subcollector (which would be N+ in an NPN device), a buried P+ layer is used. The presence of this P+ layer results in pinch-off between itself and the bipolar base. This allows much higher breakdown voltages to be achieved. In particular, the device will not break down at the bottom of the base-collector junction which is the weak spot for conventional devices. A process for manufacturing this device is described. A particular feature of this new process is that the N type epitaxial layer that is grown over the P+ layer is only about half the thickness of its counterpart in the conventional device. The process is fully compatible with conventional BiCMOS processes and has lower cost.
申请公布号 US2002105054(A1) 申请公布日期 2002.08.08
申请号 US20020091990 申请日期 2002.03.06
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY 发明人 TSAI JUN-LIN;LIU RUEY-HSIN;HWANG JEI-FENG;LIU KUO-CHIO
分类号 H01L21/331;H01L29/08;H01L29/732;(IPC1-7):H01L21/824;H01L21/822;H01L29/00;H01L27/082;H01L27/102;H01L29/70;H01L31/11 主分类号 H01L21/331
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