| 发明名称 |
SEMICONDUCTOR DEVICE WITH CONNECTION TERMINALS IN THE FORM OF A GRID ARRAY |
| 摘要 |
The semiconductor device of the present invention with an IC chip provided on one side of a substrate, comprises a plurality of connection terminals, which are provided on the other side of the substrate, are electrically connected to the IC chip through electrical connecting devices, form a rectangular grid array, and are arranged in positions other than corners of the array.
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| 申请公布号 |
US2002105096(A1) |
申请公布日期 |
2002.08.08 |
| 申请号 |
US19990437899 |
申请日期 |
1999.11.09 |
| 申请人 |
HIRATA MASAYOSHI;SUZUKI YASUHIRO;HIRAOKA TETSUYA;SATO MITSUTAKA |
发明人 |
HIRATA MASAYOSHI;SUZUKI YASUHIRO;HIRAOKA TETSUYA;SATO MITSUTAKA |
| 分类号 |
H01L23/12;H01L23/48;H01L23/498;H01L25/065;H01L25/07;H01L25/18;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
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