| 发明名称 |
SEMICONDUCTOR DEVICE INCLUDING STUD BUMPS AS EXTERNAL CONNECTION TERMINALS |
| 摘要 |
A semiconductor device includes a semiconductor chip, a resin package for sealing said semiconductor chip, metal layers provided on a mounting-side surface of said resin package in an exposed manner and connecting members for electrically connecting electrode pads provided on the semiconductor chip and the metal layers. The metal layers are provided with stud bumps on the mounting side, the stud bumps serving as external connection terminals.
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| 申请公布号 |
US2002105069(A1) |
申请公布日期 |
2002.08.08 |
| 申请号 |
US19980170260 |
申请日期 |
1998.10.13 |
| 申请人 |
KAWAHARA TOSHIMI;SUWA MAMORU;ONODERA MASANORI;MONMA SYUICHI;NAKASEKO SHINYA;HOZUMI TAKASHI |
发明人 |
KAWAHARA TOSHIMI;SUWA MAMORU;ONODERA MASANORI;MONMA SYUICHI;NAKASEKO SHINYA;HOZUMI TAKASHI |
| 分类号 |
H01L23/12;H01L21/48;H01L21/56;H01L21/68;H01L23/31;H05K3/34;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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