发明名称 Electroplating current supply system
摘要 An electroplating current supply system includes a power supply unit for supplying an object to be plated (4) with an electroplating current whose polarity is inverted at predetermined intervals. The power supply unit includes a first DC power supply (3A) supplying a positive current and a second power supply (3B) supplying a negative current. The system includes further a processing unit (58) for controlling the ratio in magnitude and duration of the positive current (I2) to the negative current (I1) supplied to the object so as to plate the object with a uniform coating.
申请公布号 US2002104755(A1) 申请公布日期 2002.08.08
申请号 US20020061600 申请日期 2002.02.01
申请人 ARAI TORU;SAKURADA MAKOTO;NISHIOKA YOSHIYUKI 发明人 ARAI TORU;SAKURADA MAKOTO;NISHIOKA YOSHIYUKI
分类号 C25D7/00;C25D5/18;C25D17/00;C25D21/12;G05F1/00;H02J1/10;H02M7/00;H02M7/12;H05K3/18;H05K3/24;(IPC1-7):C25B15/00 主分类号 C25D7/00
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