发明名称 |
Photosensitive copper paste and method of forming copper pattern using the same |
摘要 |
Provided is a photosensitive copper paste permitting the formation of a fine and thick copper pattern having high adhesion to a substrate, and having excellent preservation stability without causing gelation, and a method of forming a copper pattern, a circuit board and a ceramic multilayer substrate using the photosensitive copper paste. The photosensitive copper paste includes a mixture of an organic binder having an acid functional group, a copper powder and a photosensitive organic component. The copper powder has a surface layer having a thickness of at least 0.1 mum from the surface composed CuO as a main component. The copper powder also has an oxygen content of about 0.8% to 5% by weight.
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申请公布号 |
US2002106577(A1) |
申请公布日期 |
2002.08.08 |
申请号 |
US20010998354 |
申请日期 |
2001.11.30 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KUBOTA MASAHIRO |
分类号 |
C08K3/22;C08K5/00;C08L33/04;C08L101/02;G03F7/004;G03F7/40;H01B1/00;H01B1/22;H05K1/09;H05K3/02;H05K3/20;H05K3/46;(IPC1-7):G03F7/012;G03F7/022;G03F7/033;G03F7/34 |
主分类号 |
C08K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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