<p>Conductive powder exhibiting a high conductivity even under a state containing resin, and a conductive composition comprising it. In the application of paste for thick film, a conductive composition produced by diffusing a specified quantity of metal powder into resin is commonly used. But the metal powder has a small contact area and exhibits a high conduction resistance between connection conductors under a state containing resin because electrical connection is made through point contact on the surface of adjacent particles of metal powder. Conductive powder according to the invention has protrusions extending radially and recesses in the gaps between the protrusions. Since a conduction path is formed by fitting and linking the protrusions and the recesses to each other between adjacent particles of conductive powder and the conductive composition contains the conductive powder and resin, above mentioned problems are solved.</p>
