WORKING SHAPE PREDICTION METHOD, WORKING REQUIREMENT DETERMINATION METHOD, WORKING METHOD, WORKING SYSTEM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, COMPUTER PROGRAM, AND COMPUTER PROGRAM STORAGE MEDIUM

摘要

A polishing requirement determination means, wherein a relation between polishing requirements as elements and a working shape (polished amount) provided based on the requirements is inputted together with the type of a polished object and the polishing requirements (fixed polishing requirements) commonly used for polishing the polished objects beforehand, whereby the polishing requirements can be determined based on these requirements, namely, an oscillating rate corresponding to an oscillating position can be determined by providing the polishing requirements as the elements in time series or converting the combination of the polishing requirements as the elements to a variation in the oscillating rate of the polished object; a polishing device control means, wherein the polishing requirements determined by the polishing requirement determination means are inputted therein, and a polishing device is controlled so that these requirements can be satisfied.