MICRO-ELEMENT SUBSTRATE INTERCONNECTION

摘要

Micro-element package comprising a lower substrate in which can be embedded a micro-element chip, for example a fluidic micro-sensor or a micro-electronic component, an upper substrate and a gasket intermediate the substrates characterised in that one of said substrates includes two or more protruding pillars and the other of said substrates includes a number of recesses corresponding to the number of pillars and into which said pillars can locate so as to releasably hold said substrates together.