发明名称 |
System and method for detecting position of semiconductor wafer |
摘要 |
To prevent process defects and wafer damage caused by improperly positioned wafers, a system and method for detecting a position of a wafer determines whether the wafer is properly positioned before executing a process. The system includes a chuck plate preferably having a supporting part configured to support a lower face of the wafer and a guide part located on a perimeter of the supporting part. A sensing unit senses a positional state of the wafer on an upper portion of the supporting part. A controller receives a signal corresponding to the positional state of the wafer from the sensing unit, and determines whether the wafer is properly positioned. The controller then sends an output control signal to an outputting unit to notify an operator of the wafer position. In this manner, process defects are avoided and a fabricating yield and operating rate of a fabrication unit increases.
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申请公布号 |
US2002104229(A1) |
申请公布日期 |
2002.08.08 |
申请号 |
US20010995428 |
申请日期 |
2001.11.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIN WUN-MYONG;KIM SUN-KYU |
分类号 |
H01L21/66;H01L21/00;H01L21/68;(IPC1-7):G01B21/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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地址 |
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