| 摘要 |
PURPOSE:To provide the title assembly with high integration and high operational speed by a method wherein each element is formed into a hexagonal cylinder using a processor composed is formed into a hexagonal cylinder using a processor composed of thin film multilayered interconnection circuit as a board to be coupled with a module board. CONSTITUTION:Each element processor 1 is formed of a processor composed of a semiconductor element with a circuit printed on a semiconductor wafer interconnection patterns connecting the print circuits with one another on the semiconductor wafer circuit faces and thin film multilayered interconnection circuits comprising insulating layers while the element processor 1 is formed into a hexagonal cylinder using the processor 1 as a board. In such a constitution, the circuit of each element processor 1 is connected to a switch network 3 composed of the same structure as the device structure of processor by an input output connector 2 while the switch network 3 is coupled with a module board 4.
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