发明名称 |
Multi-layer interconnect module and method of interconnection |
摘要 |
An electronic module includes an interconnect module having a plurality of metal layers separated by a plurality of dielectric layers in a stacked structure with electronic components mounted on one surface of the module. The electronic components are selectively interconnected by drilling via holes completely through all dielectric layers with a conductive material such as solder in each via contacting metal layers to be interconnected and each metal layer which is not connected by a via having a metal pattern devoid of metal at the via location. For via connecting non-ground layers, there will be a patch of solder mask on the backside ground layer to electrically prevent this via from inadvertently connecting to ground.
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申请公布号 |
US2002105083(A1) |
申请公布日期 |
2002.08.08 |
申请号 |
US20020061546 |
申请日期 |
2002.02.01 |
申请人 |
EIC CORPORATION |
发明人 |
SUN XIAO-PENG;WANG NANLEI LARRY |
分类号 |
H01L21/48;H01L23/498;H01L23/66;H05K1/02;H05K1/14;H05K3/34;H05K3/42;(IPC1-7):H01L29/40;H01L23/52;H01L23/48 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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