发明名称 |
Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof |
摘要 |
The present invention provides an improved conditioning wheel for conditioning polishing pads used to polish semiconductor wafers. In one embodiment, the conditioning wheel includes a planar body having a metal surface located thereon. The metal surface has abrasive particles embedded therein and a retainer coating deposited over the metal surface and the abrasive particles. The retainer coating inhibits the abrasive particles from dislodging during a conditioning process.
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申请公布号 |
US2002106979(A1) |
申请公布日期 |
2002.08.08 |
申请号 |
US20010778986 |
申请日期 |
2001.02.07 |
申请人 |
NANDA ARUN K.;RODRIGUEZ JOSE OMAR;SCHULTZ LAURENCE D.;STOREY CHARLES A. |
发明人 |
NANDA ARUN K.;RODRIGUEZ JOSE OMAR;SCHULTZ LAURENCE D.;STOREY CHARLES A. |
分类号 |
B24B37/04;B24B53/12;B24D3/06;B24D3/34;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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