| 摘要 |
A cooling system in which an electronic component is cooled by using one or more containers of liquid and sorbent that transfer heat from the component to the fluid in the well bore. According to the present invention, a sorption cooling and heating system is provided for use in a well, such as down hole tool which is in a drill string through which a drilling fluid flows, or in a down hole tool, which is on a wire line. This cooling system comprises a housing adapted to be disposed in a wellbore, the sorption cooler comprising a water supply adjacent to a sensor or electronics to be cooled; a Dewar flask lined with phase change material surrounding the electronics/sensor and liquid supply; a vapor passage for transferring vapor from the water supply; and a sorbent in thermal contact with the housing for receiving and adsorbing the water vapor from the vapor passage and transferring the heat from the sorbed water vapor through the housing to the drilling fluid or well bore. The electronics or sensors adjacent to the water supply are cooled by the evaporation of the liquid. A sample chamber to be heated or other element such as a clock crystal which is intended to be heated for stability can be placed adjacent to the dessicant to provide heat.
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