| 摘要 |
<p>A sheet type heat treating device (2) comprising a processing chamber (5) for receiving a board (W) to be processed, with a shower head (10) disposed on the ceiling thereof. In applying a semiconductor processing to the board (W), a support member (28) supporting the board (W) is so disposed as to be opposed to the shower head (10). A heater lamp (30) is disposed below the support member (28) to heat the board (W) by emitting light. The support member (28) and heater lamp (30) are integrally lifted and lowered with respect to the shower head (10) by a lifting and lowering mechanism (20). The lifting and lowering mechanism (20) sets the distance between the shower head (10) and the heating lamp (30) at different values corresponding to different processing temperatures so that the temperature change of the lower surface of the shower head (10) is within a predetermined range.</p> |
