APPLICATION OF PRESSURE-SENSITIVE ADHESIVE TAPE ONTO THIN SHEET CIRCUIT SUBSTRATE

摘要

PURPOSE:To protect a circuit making surface by a method wherein the pressing down force to apply an adhesive tape onto the rear surface of a circuit substrate is supported by the pressure of pressurizing fluid. CONSTITUTION:A suction part 2 is formed on the peripheral part of a suction table 1. A surface opened recession 6 is formed on the inner periphery of suction part 2 while pressurizing holes 7 connected to a pressure source 9 are made on the peripheral wall of suction part 2. A fluid is used as a pressurizing medium. In orfer to bond a pressure-sensitive adhesive tape onto the rear surface of a semiconductor wafer, the peripheral part without making a circuit of upside-down semiconductor wafer A is mounted on the suction part 2 to be fixed. The tape is pressed down onto the rear surface (upper side) of semiconductor wafer A to be applied to it. At this time, the pressure of pressurizing medium can be balanced with the pressing down force not to bend the semiconductor wafer A at all.