| 发明名称 |
Thin-film semiconductor device and method of manufacturing the same |
| 摘要 |
A thin-film semiconductor device with a reduced influence on a device formation layer in separation and a method of manufacturing the device are provided. The manufacturing method includes the step of preparing a member having a semiconductor film with a semiconductor element and/or semiconductor integrated circuit on a separation layer, the separation step of separating the member at the separation layer by a pressure of a fluid, and the chip forming step of, after the separation step, forming the semiconductor film into chips. <IMAGE> <IMAGE> <IMAGE> <IMAGE> |
| 申请公布号 |
EP1229582(A2) |
申请公布日期 |
2002.08.07 |
| 申请号 |
EP20020002259 |
申请日期 |
2002.01.30 |
| 申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
YONEHARA, TAKAO;SAKAGUCHI, KIYOFUMI |
| 分类号 |
H01L21/322;H01L21/02;H01L21/301;H01L21/3063;H01L21/68;H01L21/762;H01L21/78;H01L21/98;H01L23/538;H01L25/065;H01L27/01;H01L27/12 |
主分类号 |
H01L21/322 |
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