SEMICONDUCTOR PACKAGE STACK METHOD AND TEST METHOD OF STACKED SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package stack method is provided to stack with only good state semiconductor packages by stacking a good state semiconductor package among a number of good state semiconductor package collected in a tray on a good state semiconductor package. CONSTITUTION: A defect detection is performed on a number of first semiconductor packages arrayed with a matrix shape on the first PCB(Printed Circuit Board)(14). After performing a singulation of the first semiconductor packages on the first PCB(14) using a sawing part, the first good state semiconductor packages are collected into a tray(12). Then, another defect detection is performed on a number of second semiconductor packages arrayed with a matrix shape on the second PCB(16). The first good state semiconductor packages are stacked on the second good state semiconductor packages. Then, another singulation is performed on the resultant structure.