发明名称 |
Integrated circuit chip and method for fabricating the same |
摘要 |
A method for fabricating an integrated circuit chip includes the steps of:(a) forming a circuit board unit with a die-receiving cavity, and a plurality of contact pads on a top surface of the circuit board unit;(b) forming a die having an upper surface provided with a plurality of solder pads;(c) placing the die in the die-receiving cavity such that the solder pads on the die are exposed;(d) wire-bonding the solder pads to the contact pads via conductive wires;(e) placing a lead frame on the circuit board unit, and connecting leads on the lead frame to corresponding ones of the contact pads via a conductive contact layer; and(f) forming a plastic protective layer to encapsulate the circuit board unit and at least a portion of the lead frame.
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申请公布号 |
US6429535(B2) |
申请公布日期 |
2002.08.06 |
申请号 |
US20010791137 |
申请日期 |
2001.02.22 |
申请人 |
COMPUTECH INTERNATIONAL VENTURES LIMITED |
发明人 |
SHEN MING-TUNG |
分类号 |
H01L21/60;H01L21/56;H01L23/495;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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