发明名称 METHOD OF ADJUSTING SPATTERING PATTERN
摘要 PROBLEM TO BE SOLVED: To provide a method of adjusting a spattering pattern so as to easily obtain a desired spattering pattern in a spatter-coating. SOLUTION: The method is to adjust a spattering pattern in a spatter-coating to form a spattering pattern by spraying the surface of a member with a coating material in an atomized state by means of a spray gun. Various spattering patterns to be obtained when applied by changing and adjusting in prescribed combinations of three application conditions of a discharge amount of the coating material to be discharged per a unit time, an atomizing pressure for atomizing the coating material to be ejected, and a patterning pressure for spraying the atomized coating material while spreading it into a prescribed range, are prepared in the form of a matrix table. When starting the spatter-coating, the above discharge amount, the atomizing pressure, and the patterning pressure are adjusted based on the supplication conditions of a desired spattering pattern applied in the matrix table.
申请公布号 JP2002219403(A) 申请公布日期 2002.08.06
申请号 JP20010020292 申请日期 2001.01.29
申请人 SEKISUI HOUSE LTD 发明人 KIMOTO TATSUTO
分类号 B05D5/06;B05D1/02;(IPC1-7):B05D5/06 主分类号 B05D5/06
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