| 摘要 |
A method and an apparatus for determining end point in a chemical mechanical polishing process by utilizing two separate laser beams are provided. When two separate laser beams of different wavelengths are utilized, the difference in the wavelengths is at least about 50 nm. For instance, one wavelength may be about 633 nm, while the other wavelength may be about 700~950 nm. When two laser beams of different incident angles are utilized, the difference in the angles may be at least 2°, and preferably at least 5°.
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