发明名称 |
Silicon wafer, and heat treatment method of the same and the heat-treated silicon wafer |
摘要 |
A method of heat-treating a silicon wafer has the steps of: preparing a silicon wafer having an oxygen concentration of 1.2x1018 atoms/cm3 or less (old ASTM) without generating crystal originated particles(COP'S) and interstitial-type large dislocation(L/D); forming a polysilicon layer of 0.1 mum to 1.6 mum in thickness on a back of the silicon wafer by a chemical-vapor deposition at a temperature of 670° C.±30° C.; and heat-treating the silicon wafer having the polysilicon layer in an oxygen atmosphere at 1000° C.±30° C. for 2 to 5 hours and subsequently at 1130° C.±30° C. for 1 to 16 hours. In this method, the silicon wafer before the formation of the polysilicon layer thereon is the type of a wafer in which oxidation induced stacking faults(OSF's) manifest itself at a center of the wafer when the wafer is subjected to the heat-treatment. Accordingly, the resulting silicon wafer with a polysilicon layer is of OSF fee and COP free, even when the wafer is subjected to the conventional OSF-manifesting heat treatment. The wafer with the polysilicon layer exerts a uniform gettering effect between the peripheral edge and center of the silicon wafer as a result of a uniform oxygen precipitation occurred at the entire surface of the silicon wafer.
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申请公布号 |
US6428619(B1) |
申请公布日期 |
2002.08.06 |
申请号 |
US20000694163 |
申请日期 |
2000.10.23 |
申请人 |
MITSUBISHI MATERIALS SILICON CORPORATION |
发明人 |
KOYA HIROSHI;FURUYA HISASHI;SUZUKI YOJI;MUROI YUKIO;SHIOTA TAKAAKI |
分类号 |
C30B33/00;H01L21/322;(IPC1-7):C30B25/02 |
主分类号 |
C30B33/00 |
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