发明名称 |
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems |
摘要 |
A machine and method for bonding puncture-type conductive contact members of an interconnect to the bond pads of a bare semiconductor die includes the use of one or two ultrasonic vibrators mounted to vibrate one or both of the die and interconnect. A short axial linear burst of ultrasonic energy enables the contact members to pierce hard oxide layers on the surfaces of the bond pads at a much lower compressive force and rapidly achieve full penetration depth.
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申请公布号 |
US6427899(B2) |
申请公布日期 |
2002.08.06 |
申请号 |
US20010921622 |
申请日期 |
2001.08.03 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
HEMBREE DAVID R.;HESS MICHAEL E.;JACOBSON JOHN O.;FARNWORTH WARREN M.;WOOD ALAN G. |
分类号 |
B23K20/10;(IPC1-7):B23K20/10;B23K31/02 |
主分类号 |
B23K20/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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