发明名称 DEVICE AND METHOD FOR BONDING FILM
摘要 PROBLEM TO BE SOLVED: To provide a device capable of precisely and automatically bonding a bonding film having an uncertain position without causing scratch and dirt in the film and generating film wrinkle causing improper appearance after bonding to automate film bonding work and produce stable quality of the film. SOLUTION: This film bonding device for bonding the bonding film and a bonded film has a film supply means, a film position detection means, a film moving means, and a film fixing means. The film position detection means detects reference marks of the bonding film and the bonded film on which one reference mark or more are formed to recognize a position and an angle of the film. The film moving means utilizes the results of the detection obtained by detecting the reference marks of the bonding film and the bonded film by the film position detection means.
申请公布号 JP2002220135(A) 申请公布日期 2002.08.06
申请号 JP20010015792 申请日期 2001.01.24
申请人 SUMITOMO BAKELITE CO LTD 发明人 NAKATANI MASAKI;SASAKI TOMIO
分类号 B65H7/02;(IPC1-7):B65H7/02 主分类号 B65H7/02
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