发明名称 MANUFACTURING METHOD FOR PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method capable of obtaining a package free of a welding defective, and high in reliability, wherein the whole periphery of the welding parts come into close contact uniformly to be airtightly welded, in pressing electrodes, even if the deviation in the plate thickness exists. SOLUTION: In the manufacturing method for the package wherein a flange part 2 of a metal cap 3, provided with an opening recess part 1 and the flange part 2 in the vicinity thereof, and a peripheral part 5 of a metal base 4 are resistance welded in a state of being pinched by a pair of electrodes 6 so as to be mutually pressed, the flange part 2 of the metal cap 3 and the peripheral part 5 of the metal base 4 are press-worked partly and over the whole periphery respectively to make into the uniform thickness, and thereafter, resistance- welded.
申请公布号 JP2002219574(A) 申请公布日期 2002.08.06
申请号 JP20010017361 申请日期 2001.01.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 SANAGAWA YOSHIHARU
分类号 B23K11/00;B23K11/14;(IPC1-7):B23K11/00 主分类号 B23K11/00
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