发明名称 Method for fabricating a multilayer ceramic substrate
摘要 A method of fabricating a multi-layer ceramic substrate for forming a first conductive pattern on a ceramic substrate. An intaglio plate is manufactured which has first and second grooves. The grooves are filled with an electroconductive paste. Conductivity of paths in the grooves is increased by deaerating and drying the paste. The intaglio plate is glued to and then separated from a ceramic substrate so that the pattern of the pattern of the electroconductive paste is transferred to the substrate. An insulation layer and a further conductive pattern are then applied.
申请公布号 US6429114(B1) 申请公布日期 2002.08.06
申请号 US19980173288 申请日期 1998.10.14
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 HAYAMA MASAAKI;MOURI NOBORU;MATSUNAGA HAYAMI
分类号 H01L21/48;H01L21/56;H01L23/12;H05K1/03;H05K1/09;H05K3/12;H05K3/20;H05K3/38;H05K3/40;H05K3/46;(IPC1-7):H01L21/44 主分类号 H01L21/48
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