Solder bump forming method and apparatus

摘要

A bump forming apparatus comprises a container for retaining therein a solder melt, a solder forming member having a side wall portion and a ceiling portion which form, above a substrate's flat surface, a chamber for receiving therein the solder melt. The solder forming member also includes a height regulator portion provided on an exterior of the side wall portion and having a flat surface for restricting the height of the solder melt during formation. Heating means for heating the solder melt may also be provided. A hole in the solder forming portion allows solder melt to flow from the container to the chamber. Pressurizing means for pressurizing the solder melt in the container to thus expedite passage of solder melt into the chamber of the forming member may be used. Depressurization means for reducing the inside pressure of the container to cause the unused metal to return from the chamber into the container may also be used.