| 发明名称 |
Method for chemical mechanical polishing using a high selective slurry |
| 摘要 |
A chemical mechanical polishing method using a modified slurry. A modified slurry is used with high platen rotational speed and high wafer carrier rotation speeds. The endpoint of the polishing process is determined by monitoring the electrical current of the wafer carrier motor.
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| 申请公布号 |
US6428387(B1) |
申请公布日期 |
2002.08.06 |
| 申请号 |
US20000615378 |
申请日期 |
2000.07.13 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
HUNT KYLE P.;MORRISON WILLIAM R. |
| 分类号 |
B24B37/04;B24B57/02;H01L21/3105;(IPC1-7):B24B1/00;B24B49/00;B24B51/00 |
主分类号 |
B24B37/04 |
| 代理机构 |
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