| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminate to be used for the manufacture of a printed- wiring board which shows high heat resistance, outstanding adhesion and durability and good dimensional precision, and further, can be made lightweight and formed to be of a thin type and is equipped with highly integrated and thinly packed wiring as well as a method for manufacturing a built-up printed-wiring board. SOLUTION: The laminate for a printed-wiring board is of such a structure that an epoxy resin composition layer with a thickness of 2 to 40μm is formed, in a semi-cured state, on one side or both sides of a heat-resistant film having a center plane average roughness (SRa) of 0.5 to 200 nm and a surface oxygen atom content of 15% or higher measured by an X-ray photoelectronic spectroscopy(XPS), the adhesive force between the heat-resistant film and the epoxy resin composition layer being 0.5 kg/cm or more. The built-up printed- wiring board is manufactured using the laminate. |
