Method for inspecting connection state of electronic part and a substrate, and apparatus for the same

摘要

A method for inspecting a connection state of an electronic part and an apparatus for the same which permits judgement of the quality of the connection state at high accuracy without needing structural addition of through holes and pads for use in connection state inspection are provided. The has the steps of: heating a first specific position on the electronic part, measuring a temperature rise of a second specific position thermally coupled to the first specific position, and judging the quality of the connection state of the solder connecting portion by comparing the measured temperature rise and a reference temperature rise.