| 摘要 |
A bare chip mounting structure includes a bare chip having inlet or outlet terminals, an interposer having openings at positions corresponding to said inlet or outlet terminals of the bare chip and a circuit board having conductive pads wherein the bare chip is mounted on the circuit board by means of the interposer in such a manner that the inlet or outlet terminals are electrically connected to the conductive pads of the circuit board through the openings of the interposer.
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